|
 |
 |
Process capability |
 |
| Serial |
Item |
Specification |
Remark |
| 1 |
Trace/Space |
2mil/2mil |
|
| 2 |
Trace/Space tolerance |
±0.02mm |
|
| 3 |
Spacing between Soldering Plate and Circuitry |
0.1mm |
|
| 4 |
Safe Spacing between Circuitry and Plate Edge |
0.15mm |
|
| 5 |
Edge Spacing |
±0.075mm |
|
| 6 |
Minimum Size of Soldering Plate |
0.3x0.3mm |
0，25mm
Round Soldering Plate |
| 7 |
Size of Circuit Plate |
0.45mm |
|
| 8 |
Minimum PTH Aperture |
0.15mm |
|
| 9 |
Screen-printing Contraposition Tolerance |
±0.2mm |
|
| 10 |
Dimension Tolerance |
±0.05mm |
|
| 11 |
Aperture/Hole Position Tolerance |
±0.05mm |
|
| 12 |
Thickness of Ni Plating |
1μm-5μm |
|
| 13 |
Thickness of Au Plating |
0.05μm-0.2μm |
|
| 14 |
Maximum Overlap Layer |
10Layers |
|
|
